04-27
均衡(heng) 電流 :80mA(VCELL=4.20V時)均衡(heng)起(qi)控點:4.180.03 V鋰(li)電池(chi)保護(hu)板原(yuan)理圖過(guo)(guo)充(chong)門(men)限(xian) :4.250.05 V (4.300.05 V可選)過(guo)(guo)放(fang)(fang)門(men)限(xian) :2.900.08 V (2.400.05 V可選)過(guo)(guo)放(fang)(fang)延時 :5mS過(guo)(guo)放(fang)(fang)釋放(fang)(fang) :斷開負載,并且各單體電池(chi)電壓均高(gao)于(yu)過(guo)(guo)…
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鋰電(dian)池(chi)(chi)保(bao)護板是(shi)對串(chuan)聯(lian)鋰電(dian)池(chi)(chi)組的(de)充(chong)放電(dian)保(bao)護。在充(chong)滿(man)電(dian)時能保(bao)證各(ge)(ge)(ge)單體電(dian)池(chi)(chi)之間的(de)電(dian)壓差異(yi)小于設(she)定(ding)值(一(yi)般20mV),實現電(dian)池(chi)(chi)組各(ge)(ge)(ge)單體電(dian)池(chi)(chi)的(de)均(jun)充(chong),有效(xiao)地改善(shan)了串(chuan)聯(lian)充(chong)電(dian)方式(shi)下的(de)充(chong)電(dian)效(xiao)果;同時檢測電(dian)池(chi)(chi)組中(zhong)各(ge)(ge)(ge)個單體電(dian)池(chi)(chi)的(de)過…
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印制(zhi)板(ban)(ban)(PCB)的(de)主(zhu)要材(cai)料是覆(fu)銅板(ban)(ban),而覆(fu)銅板(ban)(ban)(敷銅板(ban)(ban))是由(you)(you)基板(ban)(ban)、銅箔(bo)和粘(zhan)合劑構成(cheng)的(de)。基板(ban)(ban)是由(you)(you)高分子合成(cheng)樹脂和增強材(cai)料組成(cheng)的(de)絕(jue)緣層板(ban)(ban);在基板(ban)(ban)的(de)表面覆(fu)蓋著(zhu)一層導(dao)電(dian)率(lv)較高、焊接性(xing)良好的(de)純(chun)銅箔(bo),常用厚度35~50/ma;銅…
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