印制板(PCB)的(de)主要材料是(shi)覆(fu)銅板，而(er)覆(fu)銅板(敷銅板)是(shi)由基板、銅箔和粘合劑構成的(de)。

基(ji)板(ban)是由高分子(zi)合成樹脂和增強材(cai)料(liao)組(zu)成的(de)(de)(de)絕緣層(ceng)板(ban)；在(zai)(zai)基(ji)板(ban)的(de)(de)(de)表面(mian)(mian)覆(fu)(fu)(fu)(fu)蓋著一層(ceng)導電率較高、焊(han)接性良好的(de)(de)(de)純銅(tong)(tong)(tong)箔(bo)，常(chang)用厚度35～50／ma；銅(tong)(tong)(tong)箔(bo)覆(fu)(fu)(fu)(fu)蓋在(zai)(zai)基(ji)板(ban)一面(mian)(mian)的(de)(de)(de)覆(fu)(fu)(fu)(fu)銅(tong)(tong)(tong)板(ban)稱為單面(mian)(mian)覆(fu)(fu)(fu)(fu)銅(tong)(tong)(tong)板(ban)，基(ji)板(ban)的(de)(de)(de)兩面(mian)(mian)均覆(fu)(fu)(fu)(fu)蓋銅(tong)(tong)(tong)箔(bo)的(de)(de)(de)覆(fu)(fu)(fu)(fu)銅(tong)(tong)(tong)板(ban)稱雙面(mian)(mian)覆(fu)(fu)(fu)(fu)銅(tong)(tong)(tong)板(ban)；銅(tong)(tong)(tong)箔(bo)能(neng)否牢固地覆(fu)(fu)(fu)(fu)在(zai)(zai)基(ji)板(ban)上(shang)，則由粘(zhan)合劑(ji)來完(wan)成。常(chang)用覆(fu)(fu)(fu)(fu)銅(tong)(tong)(tong)板(ban)的(de)(de)(de)厚度有1．0mm、1．5mm和2．0mm三種(zhong)。

覆銅板的種(zhong)類也較多(duo)。

按(an)絕緣材料不同(tong)可(ke)(ke)分(fen)為(wei)紙(zhi)基板(ban)、玻璃布基板(ban)和(he)合成纖維板(ban)；按(an)粘結劑樹脂不同(tong)又分(fen)為(wei)酚醛(quan)、環氧、聚(ju)脂和(he)聚(ju)四氟乙烯(xi)等；按(an)用途(tu)可(ke)(ke)分(fen)為(wei)通用型(xing)和(he)特殊型(xing)。